The thermal management subgroup focus on researching of 3D IC thermal management methods and 3D IC thermal simulation methods. An entransy-based thermal management method is preliminarily validated. A full-chip-scale thermal simulation method is implemented based on developed equivalent thermal conductivity model. Microfluidic cooling methods are also under research.
Members: Yudan Pi, Daixing Wang, Longguang Zhu, Xudong Zhao.
- 1. Equivalent Thermal Conductivity Model
An equivalent anisotropic thermal conductivity model was proposed to calculate the system-level temperature distribution. It can greatly simplify the calculation by reducing the geometric size difference to less than one order of magnitude. The accuracy of the simplification was guaranteed by introducing the modified equivalent method and the thermal wire effective coefficient which represent a consideration of heat flux distribution.
- 2. Full-Chip-Scale Thermal Simulation Method for 3D IC
A finite element numerical simulation method based on equivalent thermal conductivity model is developed, which holds advantages of high accuracy achieved by finite element method and low computational consumption by introducing the equivalent thermal conductivity. The process includes data structure extracting, geometry simplification, numerical model establishment, and FE calculation. System level thermal information including temperature distribution can be obtained by post-analysis. a full-chip-scale numerical simulation method,
- Microfluidic cooling
An experimental investigation was performed on the micro-channel and thermal dissipation of distributed hotspots. It was verified that micro-channel cooling effect on a hot-spot was definitely influenced by its size. The relative position of hotspot and micro-channel had little impact on thermal dissipation as long as the keep out zone of hot-spot was in the micro-channel region. Research will be helpful to improve the accuracy of microfluidic cooling design in thermal management of 3D IC.
- Entransy-based thermal management for 3D IC
Effectiveness of the entransy, a new concept in the modern heat transfer, is examined as an evaluation criterion. Numerical results showed that the tendencies of the entransy dissipation and the maximum temperature are consistent, which preliminarily verified its applicability in thermal management of 3D-IC.